ULTRA-THIN DIAMOND BLADE WITH HUB
Detailed Product Description
ULTRA-THIN DIAMOND BLADE WITH HUB
Metal bond
Resin bond.
thickness0.01-0.015mm.
Application: Silicon, Semiconductor,such as GaAs, GaP, etc.
Features:
1. High grit concentration allows for extremely stable lifetime, reduce the size of backside chipping
2. Higer blade strength reduces wavy cutting and blade breakage
3. Shorter precut times and lower chance of blade breakage due to flying die.
ULTRA-THIN DIAMOND BLADE WITH HUB
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Company Info
Ashine Diamond Tools Co., Limited
[China (Mainland)]
[Verified Member]
City: Xiamen
Province/State: Fujian
Country/Region : China (Mainland)
Business Type:Manufacturer
Online Postings: Products