Diamond Cmp Pad Conditioner
Product Details:
| Type | Abrasive Pad |
|---|
Detailed Product Description
Diamond Cmp Pad Conditioner
Application: The dressing of polishing pad for silicon wafer
Φ20*7.3T
Φ108*6.6T
Features:
1. The single layer brazing technics make the chemical bond between diamond and brazing metal, ensure of the hold of diamonds.
2. High exposure proportion and uniformity of diamonds achieve high working efficiency.
3. Diamonds with ordered matrix
4. Long lifetime
5. Good planeness
6. Various coatings for different CMP conditions
Diamond Cmp Pad Conditioner
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Company Info
Ashine Diamond Tools Co., Limited
[China (Mainland)]
[Verified Member]
City: Xiamen
Province/State: Fujian
Country/Region : China (Mainland)
Business Type:Manufacturer
Online Postings: Products